Hytec Electronics Ltd

RoHS Policy Statement

Hytec Electronics Ltd   manufacture modular instrumentation for use in control and data acquisition systems. We endeavour to operate our business in a manner that respects and preserves the environment.

The RoHS Directive sets maximum acceptable levels of 6 substances within the composition of the product – lead, cadmium, mercury, hexavalent chromium and both polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants.

From July 1, 2006, all new electrical and electronic equipment sold within the European Union must comply with this directive unless the application is specifically exempt from the RoHS directive.

Exempt categories include:-

Fixed installation – which is defined by the EC as, a combination of several items of equipment, systems, finished products and/or components assembled and/or erected by an assembler/installer at a given place to operate together in an expected environment to perform a specific task, but not intended to be placed onto the market as a single functional or commercial unit.

Large-scale stationary industrial tool/machine – this is defined by the EC as a machine or system, consisting of a combination of equipment, systems or products, each of which is designed to be used in industry only, permanently fixed and installed by professionals at a given place in an industrial machine or in an industrial building to perform a specific task.

In addition monitoring and control instruments are currently specifically excluded. Servers and storage/storage array may use lead in solder (the limits for the other 5 substances must comply) for professional, high reliability applications for which viable lead-free alternatives have not been identified.  Other applications outside the scope include equipment for national security and equipment for capacity expansion or upgrades on products placed in the market before 1^st July 2006.

Hytec produces a wide range of electronic modules (CAMAC, VME, VME64x, PCI). These products are integrated into systems for a variety of applications including those mentioned above.

All new Hytec products will be designed to meet the RoHS directive providing the required parts are obtainable. RoHS compliant versions of existing products will be produced where possible. We will also maintain lead-based products for applications outside the scope of the RoHS directive for the foreseeable future. Hytec is already using alloy solder material along with gold over nickel PCBs at revised soldering temperatures where appropriate. It should be noted that these soldered joints appear dull and do not have the same appearance as traditional tin/lead solder. The most significant difference is that lead-free solder alloys may have a dull appearance.

This is our interpretation of the directive. As further details become available this view might change for more details please contact support@hytec-electronics.co.uk

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Last modified: October 29, 2008